DFM File Checklist Before Submitting a PCBA RFQ
Preparing Gerber, BOM, centroid, test requirements and special process notes before RFQ reduces back-and-forth communication and quotation assumptions.
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10 related articles.
Preparing Gerber, BOM, centroid, test requirements and special process notes before RFQ reduces back-and-forth communication and quotation assumptions.
BOM alternate approval cannot rely only on package and price; electrical, thermal, software, test and customer-controlled requirements must be validated.
An SMT process window should be judged by solder paste, stencil, placement, reflow, AOI and X-ray data, not final yield alone.
ICT and FCT cover different failure modes; buyers and engineers should review the test matrix instead of only asking whether testing is 100 percent.
A useful MES traceability report should connect serial number, material lot, process parameters, test results, repair records and shipment lot.
For BGA, QFN and LGA hidden-joint components, PCBA requirements should define X-ray scope, criteria, sampling level and reinspection rules early.
Conformal coating reliability depends on cleanliness, masking, thickness, curing, visual inspection and rework rules, not only material brand.
Pilot acceptance should review DFM closure, BOM risk, SMT process, test coverage, defect trend and delivery data, not only whether samples power on.
When evaluating a PCBA supplier, questions should cover DFM, BOM, SMT, testing, traceability, issue closure and delivery communication, not quotation only.
A clear RFQ package should include BOM, Gerber, centroid, schematic, test specification, annual volume, delivery target and special process notes.