Engineering experience
AI computing-card PCBA: balancing GPU and DDR assembly
A dense computing board combined packages with very different thermal behavior. The manufacturing work connected paste deposition, reflow profiling and hidden-joint inspection.
Product challenge
The manufacturing problem
Large GPU packages and smaller DDR components did not respond to the same thermal input in the same way. The assembly process needed reliable hidden joints while respecting the component temperature constraints.
Engineering work
The engineering response
A stepped stencil adjusted paste deposition across package areas. Nitrogen reflow and a product-specific thermal profile addressed the mixed thermal mass. SPI, AOI and X-ray were used as complementary inspection steps.
Project outcome
What advanced the project
The documented program progressed through trial builds into repeat orders. The transferable lesson is the combination of printing control, measured thermal behavior and inspection of hidden joints, rather than a single machine setting.
Process detail
How the work fits together
| Work package | Documented approach | Purpose |
|---|---|---|
| Printing | Stepped stencil and paste inspection | Confirm deposition for the package mix |
| Reflow | Profile tuning with nitrogen reflow | Measure the behavior of the actual assembly |
| Inspection | SPI, AOI and X-ray | Connect paste, visible assembly and hidden-joint findings |
For a similar project
Prepare the engineering discussion
- Released BOM, board data and assembly drawings
- Product operating conditions and known failure concerns
- Firmware, interfaces, fixtures and test limits
- Expected quantities, destination and qualification needs
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