Technical resource
DFM checklist before a PCB assembly RFQ
Give engineering enough information to find assembly risks before price and schedule are fixed. Focus on issues that change the process, fixture or inspection plan.
Practical checklist
Agree the inputs, responsibilities and acceptance
| Topic | Prepare or define | Check before release |
|---|---|---|
| Revision control | Gerber/ODB++, BOM, placement data and drawings | Consistent revision and component references |
| Panel and handling | Panel drawing, fiducials, tooling and board support | Edges and support permit printing, placement and depaneling |
| Components | Package drawings, polarity and height restrictions | Footprints and assembly access fit the parts |
| Thermal process | Sensitive parts, large copper areas and mixed thermal mass | Solder process can be profiled for the actual board |
| Hidden joints | BGA/QFN details and inspection requirements | X-ray and test coverage are agreed where needed |
| Through-hole and coating | Connector drawings, masking and coating material | Process sequence and protected areas are defined |
Worked example
Turn the checklist into an engineering decision
Example: a connector that prevents fixture contact may require a test-point change before tooling is ordered. Record the issue, proposed action, owner and approved revision.
Action log
Close the gaps before production
- List the missing file or unresolved decision
- Assign a customer or supplier owner
- Record the proposed action and approval needed
- Identify the affected revision and target build
- Carry open items into the pilot release decision
Sources and use
A practical guide for project preparation
Editorial guidance from Keep Best EMS, organized around the manufacturing and engineering workflow described in the company profile. The worked example is illustrative, not a customer performance claim. Updated 28 September 2026.
Use this checklist with your product drawings, component data and agreed acceptance requirements. The final manufacturing and test plan is specific to the released product.
Engineering requirements
Include the bare-board manufacturing definition
Where bare-PCB procurement is included, provide the controlled fabrication drawing and stack-up with laminate requirements, layer structure, copper requirements, finished thickness and tolerances, surface finish and hole details. Include controlled-impedance requirements and their verification method where applicable. These requirements may be supplied in referenced drawings rather than duplicated in the enquiry.
Keep fabrication data, BOM, placement data and assembly drawings at the same approved revision. Identify applicable workmanship and acceptance requirements, including the standard revision and class where specified; mark unresolved requirements for review before the build is released.
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