EMS services
PCB assembly in China and Thailand
Turn your released board design into inspected and tested assemblies. Keep Best combines component sourcing, SMT and through-hole assembly with test engineering and production in Jiangmen and Rayong.
What we do
From the BOM to a tested board
Work with one team to prepare materials, assemble your board and define the evidence needed for release. Turnkey, consigned and mixed sourcing can be organized around your BOM. For a new design, NPI connects manufacturing feedback with the pilot build.
Manufacturing work
What is included in the work package
| Work area | What we do | What the definition covers |
|---|---|---|
| SMT | Printing, placement and nitrogen reflow | Board geometry, package mix and measured reflow profile |
| Through-hole | Wave or selective soldering according to the selected site and product | Connector access, thermal sensitivity and assembly sequence |
| Inspection | SPI, AOI and X-ray selected for the board | Paste deposition, visible assembly features and hidden joints |
| Electrical verification | ICT and functional testing where defined for the project | Test access, fixtures, firmware, loads and pass/fail limits |
| Protection and finish | Coating, programming and integration where included | Masking, material, software revision and final identification |
Your deliverables
What moves forward with your product
- Assemblies built to the released BOM and drawings
- First-article findings and agreed inspection results
- Programming and functional-test records where included
- Material and revision traceability defined for the order
Engineering in practice
Connect the service to a real manufacturing challenge
Getting started
Send the inputs you have
Start with your BOM, PCB or assembly data, target quantities and the checks the product needs. Include firmware, mechanical drawings or a sample description when they are relevant. If the package is incomplete, tell us what is available so we can identify the next step.
Engineering requirements
Agree handling and acceptance before production
The build package should identify workmanship requirements, applicable standard revisions and acceptance class, together with ESD and moisture-sensitive component handling needs. Confirm solder-paste handling, any component drying or baking instructions, and repair and re-test requirements for the selected materials and manufacturing route.
Use component and material supplier instructions with the agreed product requirements; a generic baking temperature or reflow profile is not a substitute for a product-specific process definition.
Start a conversation
Discuss your PCB assembly project
Tell us what you need to build or the question you would like to discuss. Our team will help define the next step.
We can sign a non-disclosure agreement before discussing sensitive designs. Your project information and files are handled confidentially.