EMS · Capabilities
Manufacturing capabilities, from SMT to box build
Compare the processes documented at our Jiangmen and Rayong bases, then discuss the board, materials and test requirements that determine your production route.
Factory processes
Compare the two manufacturing bases
| Process | Jiangmen | Rayong | Project inputs |
|---|---|---|---|
| SMT assembly | Yamaha YSM20R placement; nitrogen reflow | Yamaha YRM20 placement; nitrogen reflow | BOM packages, board geometry and the thermal profile |
| Through-hole assembly | Wave and selective soldering; post-solder operations | Wave soldering and post-solder operations | Thermal sensitivity, connectors, fixtures and mixed assembly sequence |
| Inspection | SPI, AOI, X-ray and first-article inspection | SPI, AOI, X-ray and first-article inspection | Inspection method and acceptance criteria for the board |
| Functional test | FCT and project test fixtures | FCT and project test fixtures | Test software, loads, interfaces and unit/batch records |
| Protection & integration | Selective conformal coating and final assembly | Selective conformal coating and assembly support | Masking, coating material, enclosure and final product checks |
Engineering reference
Board and assembly data for an initial review
Reference values come from the group capability profile, p.27; they are not a specification for both sites or an automatic acceptance of every design.
| Item | Reference in the group capability profile | Confirm before production |
|---|---|---|
| SMT board size | Conventional range: 50 × 50 mm to 450 × 400 mm | Panel design, support and the selected equipment route |
| SMT board thickness | Conventional range: 0.5–3 mm | Warpage, handling and support requirements |
| Small component package | Imperial 0201 (nominal 0.6 × 0.3 mm) listed as conventional; imperial 01005 (nominal 0.4 × 0.2 mm) as special process | Package, board layout and inspection plan |
| Fine-pitch assembly | QFP lead pitch: 0.35 mm; BGA ball pitch: 0.35 mm, listed separately in the profile | Package drawing, land pattern, stencil, board warpage and inspection/test plan |
| CNC depaneling | Profile lists ±0.2 mm outline tolerance | Fixture and product-specific acceptance |
| Conformal coating | Profile reference: 25–50 µm; material and wet/dry-film basis are not specified | Confirm material, wet or cured-film thickness, masking, cure and measurement method |
Test engineering
Choose inspection and test around the failure modes
SPI, AOI and X-ray provide manufacturing inspection. ICT and FCT require the circuit access, fixture, software and acceptance limits agreed for the product. Our company profile also identifies internally developed ICT/FCT and aging-test work.
Start a conversation
Discuss your manufacturing project
Tell us what you need to build or the question you would like to discuss. Our team will help define the next step.
We can sign a non-disclosure agreement before discussing sensitive designs. Your project information and files are handled confidentially.